TY - GEN
T1 - Systematic mapping study on high-level content design frameworks for augmented reality
AU - Apaza, Yuliana
AU - Tumailla, Richard
AU - Hancco, Wilder
AU - Paz-Valderrama, Alfredo
AU - Corrales-Delgado, Carlo
AU - Loaiza, Manuel
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/10
Y1 - 2018/10
N2 - Augmented Reality (AR) is expected to be one of the technologies that will have a high impact on different areas such as education, maintenance or game development. One of the main drawbacks of using this technology has been the complexity for users without programming skills to create AR applications. The use of High-Level Content Design Frameworks (HCDF) is proposed as a solution to facilitate the process of developing AR applications. There are different types of HCDF, but it is necessary to classify them so further research would fill gaps in the current literature. To the best of our knowledge, no research has been done focusing on analyzing the articles related to HCDF. As a solution to these problems, we have proposed a systematic method to classify and find current trends in research focused on HCDF.
AB - Augmented Reality (AR) is expected to be one of the technologies that will have a high impact on different areas such as education, maintenance or game development. One of the main drawbacks of using this technology has been the complexity for users without programming skills to create AR applications. The use of High-Level Content Design Frameworks (HCDF) is proposed as a solution to facilitate the process of developing AR applications. There are different types of HCDF, but it is necessary to classify them so further research would fill gaps in the current literature. To the best of our knowledge, no research has been done focusing on analyzing the articles related to HCDF. As a solution to these problems, we have proposed a systematic method to classify and find current trends in research focused on HCDF.
KW - Augmented reality
KW - Authoring tool
KW - Content design framework
KW - Systematic mapping study
UR - http://www.scopus.com/inward/record.url?scp=85072067623&partnerID=8YFLogxK
U2 - 10.1109/SVR.2018.00037
DO - 10.1109/SVR.2018.00037
M3 - Conference contribution
AN - SCOPUS:85072067623
T3 - Proceedings - 2018 20th Symposium on Virtual and Augmented Reality, SVR 2018
SP - 192
EP - 201
BT - Proceedings - 2018 20th Symposium on Virtual and Augmented Reality, SVR 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th Symposium on Virtual and Augmented Reality, SVR 2018
Y2 - 29 October 2018 through 1 November 2018
ER -